Apparatus for conditioning power and managing thermal energy in an electronic device

ABSTRACT

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

BACKGROUND OF THE INVENTION

[0001] This invention relates to a method and an apparatus forelectrical power conditioning and thermal capture/rejection managementsystems; and more particularly, in one aspect, to integrating electricalpower conditioning techniques and heat capture and removal techniquesinto or onto a common substrate, such as silicon, germanium, galliumarsenic.

[0002] Electronic and electrical devices continue to demand additionalpower as the number of transistors on a semiconductor device, forexample a microprocessor, increase dramatically. As a result of thatincreasing demand, there is an increasing demand on the powerconditioning and heat rejection capabilities of systems that supportsuch devices. For example, as microprocessor speed and transistor countincrease, there is an increasing requirement for electrical power (anincrease in average power consumption) conditioning. Further, as moreand more functions are integrated into the microprocessor, for example,the functions typically performed by the floating point processors andvideo or graphics processors, the power conditioning system must addressor respond to the rapidly varying temporal and spatial levels of powerconsumption. Moreover, the increase in microprocessor speed andtransistor count, and the incorporation of more and more functions intothe microprocessor, have also created a rapidly increasing requirementto capture and remove heat generated by such microprocessors.

[0003] Power supplies are available to meet the power demands, however,the power supply is often located some distance from the consumingdevice. The finite wire lengths between the supply and the deviceinclude capacitance and inductance that introduce time delays in thedelivery of power in response to changes in demand by the consumingdevice. As mentioned above, the temporal change in power consumption of,for example, a microprocessor, is increasing as processor speedsincrease and as more and more functions are incorporated into themicroprocessor. In response, power conditioning electrical/electronicssystems are being placed closer and closer to the consuming device.Locating the power conditioning elements, such as voltage regulators,capacitors, DC-DC converters, near the consuming device may address theconcerns regarding the power conditioning needs.

[0004] A conventional configuration of the power conditioning system isillustrated in FIG. 1. That system often includes discrete capacitors,voltage regulators, and AC-DC or DC-DC converters. Briefly, discretecapacitors typically are located in physical proximity with andelectrically connected to the integrated circuit device. As such, suddendemands by the device during operation may be satisfied by the chargestored on the capacitor, thereby maintaining a relatively constant inputvoltage for the time necessary for the increased demand to be addressedby the supply. Such capacitors are typically known as bypass capacitors,and are common elements in analog circuit design, digital circuitdesign, and power device circuit design.

[0005] Voltage regulators are employed to take input power at a highvoltage (for example, 7 volts), and provide relatively stable outputpower at a lower voltage (for example, 1 to 5 volts). Voltage regulatorstend to provide the lower voltage with greatly increased immunity tovariations in the high voltage level, or to variations in current drawnby the consuming device. Regulators are commonly employed in designs ofanalog and digital electronic power conditioning systems, and areincreasingly likely to be placed in proximity to devices that haverapidly time-varying power requirements.

[0006] AC-DC and DC-DC converters are employed to transform a particularsupply voltage from a convenient source into an appropriate form forconsumption by, for example, the integrated circuit device. In manycases, system power electronics provide for a single, relatively highvoltage (for example, 48 volt DC, or 110 volt AC), whereas theintegrated circuit device may require very different supply voltages(for example, 1 to 5 volts, DC). Under this circumstance, converterstransform the power and provide the input voltage required by thedevice. In some systems, converters are located as close to theconsuming device as possible so as to provide stable voltage duringvariations in power consumption by that device. (See, for example, U.S.Pat. Nos. 5,901,040; 6,191,945; and 6,285,550).

[0007] In addition to the power management considerations, the increasein power consumption of these devices has imposed an additional burdenon the thermal management system (i.e., systems that capture, removeand/or reject energy in the form of heat). In response, thermalmanagement systems have employed such conventional techniques as heatsinks, fans, cold plates systems that employ cooling water, and/orcombinations thereof for heat-capture, removal and rejection from, forexample, an integrated circuit device. Such conventional heat managementdesigns locate the thermal capture and rejection elements on or verynear the integrated circuit device packaging. (See, for example, U.S.Pat. Nos. 6,191,945 and 6,285,550).

[0008] For example, with reference to FIG. 1, heat sinks generallyconsist of metal plates with fins that transport heat from the consumingdevice to the surrounding air by natural convection. Heat sinks tend tobe located or positioned directly on the integrated circuit devicepackaging. Heat sinks serve to increase the area of contact between thedevice and the surrounding air, thereby reducing the temperature risefor a given power.

[0009] One technique to enhance the heat transfer between a heat sinkand the surrounding air is to employ a fan (typically rotating bladesdriven by electric motors) in conjunction with a heat sink. Fans mayenhance the heat transfer between a heat sink and the surrounding air bycausing the air to circulate through the heat sink with greater velocitythan by natural convection.

[0010] Another technique used by conventional systems to enhance thecapabilities of the thermal management system is to reduce the thermalresistance between the consuming device and the heat sink. This ofteninvolves reducing the number and thickness of the layers between thedevice, the device package and the heat sink. (See, for example, U.S.Pat. Nos. 6,191,945 and 6,285,550).

[0011] In sum, conventional systems address power conditioning andthermal management requirements by placing both the power conditioningand heat capture and rejection elements as close to the integratedcircuit device as possible. This has led to the typical, conventionallayout that is illustrated in FIG. 1. With reference to FIG. 1, theconsuming device is an integrated circuit device. The thermal managementelement is heat sink that is in contact with the consuming device. Insome implementation, the heat capture, removal and rejection (via theheat sink) may be relatively high.

[0012] Further, the power conditioning circuitry (capacitors, voltageregulators, AC-DC and DC-DC converters) is positioned next to theconsuming device to reduce the wiring length between the supply and theintegrated circuit device.

[0013] While such conventional power conditioning and thermal managementtechniques may be suitable for power consumption and heatcapture/rejection requirements for some current device, conventionaltechniques are unlikely to address the anticipated increases in bothpower consumption and heat capture, removal and rejection requirementsof other current devices as well as future devices. Accordingly, thereis a need for new power conditioning techniques to accommodateanticipated increases in both power consumption and heat capture,removal and/or rejection requirements.

[0014] Moreover, there is a need for improved power conditioning andthermal management techniques to accommodate increases in both powerconsumption and heat capture, removal and rejection requirements ofcurrent and future device. Further, there is a need for improved powerconditioning and thermal management techniques for devices that may beimplemented in space-constrained applications (for example, portablecomputers). In this regard, there is a need for incorporating the powerconditioning and heat capture/rejection elements into the same volume ina stacked configuration as well as address the anticipated increases inboth power consumption and heat capture, removal and rejectionrequirements.

[0015] In addition, there is a need for an improved technique(s) ofpower conditioning and heat capture/rejection that integrate the powerconditioning and heat capture rejection elements with the consumingdevice (for example, an integrated circuit device) itself—therebyreducing the deficiencies in the power conditioning due to delays insignal propagation, reducing the thermal resistance from the device tothe heat sink due to physical separation and additional interfaces. Thisresults in increasing the overall efficiency of both power conditioningand thermal management capabilities of the system.

[0016] Moreover, there is a need for power conditioning and heatcapture/rejection elements that are stacked in a compact configurationto facilitate a compact packaged device which limits deficiencies in thepower conditioning due to delays in signal propagation, and enhances thethermal attributes of the packaged device.

[0017] Further, while such conventional power conditioning techniquesmay be suitable for some applications, there is a need for a powerconditioning technique that addresses the anticipated increases in powerconsumption in all applications. For example, there is a need forimproved power conditioning technique for devices that may beimplemented in space-constrained applications. Accordingly, there is aneed for improved power conditioning techniques to accommodateanticipated increases in power consumption as well as applicationshaving stringent space requirements.

SUMMARY OF THE INVENTION

[0018] In a first principal aspect, the present invention is a powerconditioning module, affixed to an integrated circuit device, forconditioning power to be applied to the integrated circuit device. Thepower conditioning module includes a semiconductor substrate having afirst interface and a second interface wherein the first interfaceopposes the second interface. The power conditioning module furtherincludes a plurality of interface vias, to provide electrical connectionbetween the first interface and the second interface, and a first set ofpads disposed on the first interface, each of these pads is connected toa corresponding one of the interface vias on the first interface. Thepower conditioning module also includes a second set of pads disposed onthe second interface, each of these pads is connected to a correspondingone of the interface vias on the second interface.

[0019] In addition, the power conditioning module includes electricalcircuitry, disposed within a semiconductor substrate, to condition thepower to be applied to the integrated circuit device. The electricalcircuitry may be disposed on the first interface, the second interface,or both interfaces. Moreover, the electrical circuitry includes at leastone voltage regulator and at least one capacitor.

[0020] In one embodiment of this aspect of the invention, the powerconditioning module also includes at least one power pad disposed on thesecond interface and at least one power via disposed in thesemiconductor substrate. The power via is electrically connected to thepower pad to provide electrical connection between the second interfaceand at least one of the voltage regulator and capacitor. The power viamay be electrically connected to a power conduit disposed in thesemiconductor substrate. The combination of the power pad, via andconduit provides electrical connection between the second interface andat least one of the voltage regulator and capacitor.

[0021] In another embodiment, the power conditioning module may includeat least one output power conduit, coupled to the electrical circuitry,to provide conditioned power to the integrated circuit device. Theoutput power conduit may connect to an input power pad disposed on thefirst interface. The input power pad may correspond to an input of theintegrated circuit device.

[0022] The power conditioning module of this aspect of the invention mayalso include current sensor(s), disposed in the semiconductor substrate,to provide information that is representative of a current consumptionof the integrated circuit and/or electrical circuit. A controller,coupled to the current sensor, may receive that information and, inresponse, may adjust the cooling of the integrated circuit and/or thepower conditioning module.

[0023] The power conditioning module may also include temperaturesensor(s), disposed in the semiconductor substrate, to provideinformation that is representative of a temperature of a region inproximity to the temperature sensor. A controller may be coupled to thetemperature sensor to receive that information and, in response, mayadjust the cooling of the integrated circuit and/or the powerconditioning module.

[0024] In a second principal aspect, the present invention is a powerconditioning and thermal management module adapted to couple to anintegrated circuit device. The power conditioning and thermal managementmodule includes a power conditioning element having a first interfaceand a second interface, wherein the first interface opposes the secondinterface. The power conditioning element includes a semiconductorsubstrate, a plurality of interface vias, disposed in the semiconductorsubstrate, and electrical circuitry to condition the power to be appliedto the integrated circuit device. The electrical circuitry includes atleast one voltage regulator and at least one capacitor. The electricalcircuitry may be disposed on the first interface, second interface orboth interfaces of the power conditioning element.

[0025] The power conditioning and thermal management module of thisaspect of the invention further includes a thermal management elementhaving a first interface and a second interface wherein the firstinterface opposes the second interface. The thermal management element,during operation, uses a fluid having a liquid phase to capture thermalenergy. The thermal management element includes a substrate, wherein thesubstrate includes at least a portion of a micro channel disposedtherein and configured to permit fluid flow therethrough.

[0026] The thermal management element also may include a plurality ofinterface vias to provide electrical connection between the firstinterface and the second interface of the thermal management element.The plurality of interface vias of the thermal management element mayconnect to a corresponding one of the plurality of interface vias of thepower management element to provide electrical connection between thefirst interface of the power conditioning element and the secondinterface of the thermal management element. In this regard, the firstinterface of the thermal management element may be physically bonded tothe second interface of the power conditioning element.

[0027] The power conditioning and thermal management module of thisaspect of the invention may also include a pump (for example, anelectro-osmotic pump), adapted to connect to the micro channel, toproduce the flow of the fluid in the micro channel.

[0028] In one embodiment of this aspect of the invention, the powerconditioning and thermal management module includes current sensor(s),disposed in the semiconductor substrate, to provide information that isrepresentative of a current consumption of the integrated circuit and/orthe electrical circuitry. The power conditioning and thermal managementmodule may also include a controller, coupled to the current sensor, toreceive the information that is representative of the currentconsumption of the integrated circuit. In response to that information,the controller may adjust the flow of the fluid in the micro channel. Inthis regard, the controller may adjust a rate of flow of fluid output bythe pump.

[0029] In another embodiment, the power conditioning and thermalmanagement module includes temperature sensor(s), disposed in the powerconditioning and thermal management module, to provide information whichis representative of the temperature of a region of the powerconditioning and thermal management module or in a region of theintegrated circuit. A controller, coupled to the temperature sensor, mayreceive the temperature indicative information and, in response thereto,may adjust the flow of the fluid in the micro channel. For example, thecontroller may adjust a rate of flow of fluid output by the pump.

[0030] In yet another embodiment of this aspect of the invention, thepower conditioning and thermal management module includes at least onepower pad disposed on the second interface of the thermal managementelement and at least one power via. The power via is electricallyconnected to the power pad to provide electrical connection between thesecond interface of the thermal management element and at least one ofthe voltage regulator and capacitor. The power via may be electricallyconnected to a power conduit disposed in the semiconductor substrate ofthe power management element. The power conduit provides electricalconnection between the power via and the electrical circuitry (i.e., atleast one of the voltage regulator and capacitor).

[0031] In another embodiment, the power conditioning and thermalmanagement module includes at least one power via disposed in thesubstrate of the thermal management element, at least one power paddisposed on the second interface of the thermal management element, andat least one output power conduit, coupled to the electrical circuitry,to provide conditioned power to the integrated circuit device. The powerpad of this embodiment is electrically connected to the power via toprovide electrical connection between the second interface of thethermal management element and the electrical circuitry. The outputpower conduit may connect to an input power pad disposed on the firstinterface of the power conditioning element. The input power padcorresponds to the power input pin/pad of the integrated circuit device.

[0032] In a third principal aspect, the present invention is a powerconditioning and thermal management module that couples to an integratedcircuit device. The power conditioning and thermal management module hasa first interface and a second interface wherein the first interfaceopposes the second interface. The power conditioning and thermalmanagement module includes a semiconductor substrate, a plurality ofinterface vias to provide electrical connection between the firstinterface and the second interface, and a first plurality of padsdisposed on the first interface, each of the first plurality of pads isconnected to a corresponding one of the interface vias on the firstinterface. The power conditioning and thermal management module alsoincludes a second plurality of pads disposed on the second interface,each of the second plurality of pads is connected to a corresponding oneof the interface vias on the second interface.

[0033] In addition, the power conditioning and thermal management moduleincludes electrical circuitry and a micro channel structure. Theelectrical circuitry is disposed in the semiconductor substrate andconditions the power to be applied to the integrated circuit device. Theelectrical circuitry may be disposed on the first interface, the secondinterface or both interfaces. The electrical circuitry includes at leastone voltage regulator and at least one capacitor. The micro channelstructure includes at least one micro channel disposed in thesemiconductor substrate to capture thermal energy.

[0034] The power conditioning and thermal management module of thisaspect of the invention may also include current sensor(s), temperaturesensor(s), and a controller. The current sensor(s), temperaturesensor(s), and/or controller may be disposed in the power conditioningand thermal management module. The controller, may be coupled to thecurrent sensor(s) and/or temperature sensor(s), to receive the currentor temperature indicative information and, in response thereto, mayadjust the rate of capture of thermal energy by the micro channelstructure. In this regard, the controller may adjust the flow of thefluid in the micro channel and/or a rate of flow of fluid output by thepump.

[0035] In one embodiment of this aspect of the invention, the powerconditioning and thermal management module includes at least one powerpad disposed on the second interface and at least one power via. Thepower pad is electrically connected to the power via to provideelectrical connection between the second interface and at least one ofthe voltage regulator and capacitor. The power via may be electricallyconnected to a power conduit disposed in the semiconductor substrate.The power conduit provides electrical connection between the power padand at least one of the voltage regulator and capacitor.

[0036] In another embodiment, the power conditioning and thermalmanagement module includes at least one output power conduit, coupled tothe electrical circuitry, to provide conditioned power to the integratedcircuit device. The output power conduit may connect to an input powerpad disposed on the first interface of the power conditioning element.The input power pad may correspond to the power input of the integratedcircuit device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In the course of the detailed description to follow, referencewill be made to the attached drawings. These drawings show differentaspects of the present invention and, where appropriate, referencenumerals illustrating like structures, components and/or elements indifferent figures are labeled similarly. It is understood that variouscombinations of the structures, components and/or elements other thanthose specifically shown are contemplated and within the scope of thepresent invention.

[0038]FIG. 1 is a block diagram representation of a conventionalapproach to power conditioning and heat capture/rejection for integratedcircuit, for example, microprocessors;

[0039]FIG. 2 is a cross-sectional view of a discrete power conditioningmodule in accordance with one aspect of the present invention;

[0040]FIG. 3 is a block diagram representation of an embodiment of thepower conditioning module of FIG. 2 incorporated in an integratedcircuit application;

[0041]FIG. 4 is a block diagram representation of another embodiment ofthe power conditioning and heat capture/rejection module according tothe present invention incorporated in an integrated circuit application;

[0042]FIG. 5 is a cross-sectional view of a discrete power conditioningmodule, including power and ground conduits, in accordance with anaspect of the present invention;

[0043]FIG. 6 is a block diagram representation of a top view of theinterface of the power conditioning module according to one aspect ofthe present invention;

[0044]FIG. 7 is a block diagram representation of an embodiment of apower conditioning and thermal management module according to one aspectof the present invention incorporated in an integrated circuitapplication;

[0045]FIG. 8 is a cross-sectional view of a power conditioning andthermal management module in accordance with one aspect of the presentinvention;

[0046]FIG. 9 is a block diagram representation of the power conditioningand thermal management module of FIG. 8 incorporated in an integratedcircuit application;

[0047]FIG. 10A is a top of a micro channel configuration of a thermalmanagement element in accordance with one aspect of the presentinvention;

[0048]FIG. 10B is a cross sectional view, along line AA, of the microchannel configuration of a thermal management element illustrated inFIG. 10A;

[0049]FIG. 11 is a block diagram representation of another embodiment ofthe power conditioning and thermal management module, incorporated in adual-in-line package, face-down integrated circuit application;

[0050]FIG. 12A is a block diagram representation of another embodimentof the power conditioning and thermal management module, incorporated ina dual-in-line package, face-up integrated circuit application;

[0051]FIG. 12B is a block diagram representation of the embodiment ofthe power conditioning and thermal management module, incorporated in adual-in-line package, face-up integrated circuit application of FIG. 12Ain conjunction with a package lid;

[0052]FIG. 13 is a cross-sectional view of another embodiment of thepower conditioning and thermal management module, mounted on a printedcircuit board, in accordance with the present invention;

[0053]FIG. 14 is a cross-sectional view of another embodiment of thepower conditioning and thermal management module of the presentinvention;

[0054]FIG. 15 is a block diagram representation of an embodiment of thepower conditioning and thermal management module of FIG. 12 incorporatedin an integrated circuit application;

[0055]FIG. 16 is a cross-sectional view of another embodiment of thepower conditioning and thermal management module of the presentinvention;

[0056]FIG. 17A is a block diagram representation and cross-sectionalview of an embodiment of the integrated power conditioning and heatcapture/rejection module of FIG. 16, in conjunction with a discrete heatcapture/rejection module, incorporated in an integrated circuitapplication;

[0057]FIG. 17B is a block diagram representation and cross-sectionalview of an embodiment of the integrated power conditioning and heatcapture/rejection module of FIG. 16, in conjunction with a discretethermal capture element, incorporated in an integrated circuitapplication;

[0058]FIG. 18 is a cross-sectional view of a power conditioning andthermal management module in accordance with another aspect of thepresent invention;

[0059]FIGS. 19A, 19B and 19C are block diagram representation's of thepower conditioning and thermal management modules incorporated in anintegrated circuit application;

[0060]FIG. 20 is a block diagram representation of one embodiment of aclosed-loop power conditioning and thermal management system accordingto the present invention;

[0061]FIG. 21 is a block diagram representation of another embodiment ofthe closed-loop power conditioning and thermal management systemaccording to the present invention;

[0062]FIG. 22 is a block diagram representation of another embodiment ofthe closed-loop power conditioning and thermal management systemaccording to the present invention;

[0063]FIG. 23 is a block diagram representation of another embodiment ofthe power conditioning system according to the present invention; and

[0064]FIG. 24 is a block diagram representation of a closed loop powerconditioning and thermal management system, including power and thermalbuses, according to another aspect of the invention.

DETAILED DESCRIPTION

[0065] The present invention is directed to a technique of, and systemfor conditioning the power applied to a consuming device (for example,an integrated circuit device). The technique and system of the presentinvention optimize or enhance the power conditioning of the input powerfor a consuming device by stacking the power conditioning circuitry onor under the consuming device. Several embodiments of the presentinvention are well suited for use in space-constrained applications,such as portable or handheld applications, that require a wellconditioned input power supply for the consuming device. As such, theseembodiments provide an efficient, compact (reduced volume), costeffective power conditioning system.

[0066] The present invention is also directed to a technique of, andsystem for conditioning the power applied to a consuming device as wellas managing the heat capture, removal, and/or rejection of a consumingdevice and the electrical circuitry for conditioning the power. Thetechnique and system of the present invention optimize or enhance thepower conditioning and thermal management capabilities according toconstraints dictated by, for example, the environment of the applicationand the needs of the consuming device and system. In this regard, inseveral of the embodiments, the technique and system of the presentinvention are also well suited for use in space-constrained applicationsthat also require high heat capture, removal and rejection capabilities.The techniques and systems of these embodiments may combine or integratethe power conditioning circuitry and thermal management element into thesame substrate, substrates that have similar footprints, and/or thesubstrate of the consuming device. As such, the power conditioning andthermal management system of these embodiments provide an efficient,compact, cost effective power conditioning and thermal managementtechniques.

[0067] The present invention also includes embodiments that employ athermal management element that includes a controller that receivesfeedback signals from parameter sensors (for example, temperature,pressure and flow) and, responsively modifies the fluid flow from apump(s), or modifies the fluid flow in the micro channel structure of aheat capture, removal and/or rejection element.

[0068] The present invention may also employ a current sensor(s) toprovide information representative of the current consumption of theconsuming device and/or power conditioning circuitry to a controller.The controller may, in response to that information, anticipate a changein the heat generation of the consuming device and/or power conditioningcircuitry and modify the heat capture, removal and/or rejectioncapabilities of the thermal management element(s). For example, where apump is employed to provide a working fluid to capture and remove heat,the controller may modify the fluid flow from a pump(s), or modify thefluid flow in the micro channels, to address the anticipated thermalmanagement heeds of the consuming device and/or the power conditioningelement caused by the change in power consumption.

[0069] To further reduce the footprint presented by the powerconditioning and thermal management system the thermal managementelements may be integrated with the power management module into acommon substrate or structure. In this regard, the thermal managementelement(s) may employ a micro channel structure to capture and removeheat from the consuming device and/or the power conditioning circuitry.

[0070] Moreover, the present invention provides a power and thermalmanagement module that may be located or arranged in a manner toefficiently enhance or optimize the power conditioning capabilitiesdepending on the needs or requirements of the system. In addition,location or arrangement of the power and thermal management module ofthe invention may enhance or optimize the heat capture, removal and/orrejection capabilities of the system. In this regard, the relativelocation or position of the power conditioning element(s) and thermalmanagement element(s) to each other, and to the consuming device, mayenhance or optimize the thermal management as well as power conditioningperformance of the system. Under certain circumstances, more than onethermal management element may be implemented in order to furtherenhance the heat capture and rejection capabilities that may furtherenhance the reliability of the system (for example, the power managementmodule and the consuming device).

[0071] With reference to FIGS. 2, 3 and 4, in one embodiment, thepresent invention is power conditioning module 100 that may be disposedbetween device 200 (for example, an integrated circuit device such as amicroprocessor) and printed circuit board 400, as illustrated in FIG. 3,or between device 200 and thermal management module 300, as illustratedin FIG. 4. The location of power conditioning module 100, relative toconsuming device 200 and thermal management module 300, may be selectedaccording to power, thermal and space considerations of system 10.

[0072] The power conditioning module 100 of FIG. 2 includes asemiconductor substrate 102, interface vias 104 a-104 h, interface pads106 a-106 p, power and ground vias 108 a and 108 b, power and groundpads 110 a and 110 b, and electrical circuitry 112. The semiconductorsubstrate 102 includes a first interface for mating or interfacing withdevice 200 and a second interface for mating or interfacing with asubstrate or board 400 (for example, a system printed circuit board suchas a mother or daughter board).

[0073] The semiconductor substrate 102 may be fabricated from a numberof well known materials including, for example, silicon or germanium. Incertain circumstances, it may be advantageous to use a material that isthe same as, or has similar properties (for example, thermal expansion)to the material used for the substrate of device 200. Such aconfiguration may provide for enhanced operating reliability since thesimilar thermal expansion properties of power conditioning module 100and device 200 may minimize the potential for defects in the electricalconnections between power conditioning module 100 and device 200typically caused during operation because of differences in thermalexpansion coefficients. Moreover, using the same material or materialspermits the use of the same or similar fabrication techniques andfacilities/equipment thereby potentially reducing manufacturing costs.

[0074] The interface vias 104 a-104 h provide electrical connection forsignals used by device 200 but not used by power conditioning module 100in conditioning the power for device 200. In this regard, powerconditioning module 100 provides the electrical interconnects for othersignals, such as the data and address signals, used by device 200. Forexample, where device 200 is a microprocessor device, interface vias 104a-104 h may provide an electrical pathway, through power conditioningmodule 100, between the microprocessor and, for example DRAM or SRAMmemory devices. Thus, signals from other parts of system 10 (forexample, DRAM or SRAM memory devices) may travel or propagate by way ofsignal traces on printed circuit board 400—through power conditioningmodule 100—to device 200 by way of interface vias 104-104 h.

[0075] The interface vias 104 a-104 h may be fabricated usingconventional processing techniques. Where the number of signals thattravel to and from device 200 is large, it may be preferable to employhighly anisotropic etching to form narrow pathways in substrate 102 andto deposit (for example, using CVD or LPCVD techniques) a highlyconductive material such as gold, copper, aluminum, or highly dopedpolysilicon into the pathways to facilitate a highly conductiveinterconnection.

[0076] With continued reference to FIG. 2, power conditioning module 100of this embodiment may further include interface pads 106 a-106 p tofacilitate greater conductivity between power conditioning module 100and device 200 or board 400. In this regard, the interface pads 106a-106 p allow for greater tolerance in mating or interfacing powerconditioning module 100 to board 400 and/or device 200. The interfacepads 106 a-106 p may be fabricated using conventional techniques fromhighly conductive material such as gold, copper or aluminum. In apreferred embodiment, the same material is used for both interface vias104 a-104 h and interface pads 106 a-106 p. Indeed, pads 106 a-106 p maybe fabricated in the same or similar manner and materials as used inball grid array (“BGA”) or chip scale package (“CSP”) devices. The term“pad”, as used herein, includes the “ball” connection technology used inBGA packages, CSP packages, and the like.

[0077] With continued reference to FIG. 2, power conditioning module 100may also include power and ground vias 108 a and 108 b to provide asupply voltage, supply current, reference voltages, and/or ground(supply) voltages to electrical circuitry 112. The power and ground vias108 a and 108 b may be designed and fabricated in the same manner asinterface vias 104 a-104 h.

[0078] It should be noted that, while only two power and ground vias areillustrated, it will be appreciated by those skilled in the art thatadditional power and ground vias may be employed where necessary oradvantageous. Moreover, it should be noted that power and ground vias108 a and 108 b may provide other voltages or currents that arenecessary for electrical circuitry 112 to perform the functionsdescribed herein or any other desirable functions.

[0079] The power conditioning module 100 may also include power andground pads 110 a and 110 b to enhance electrical conductivity betweenpower conditioning module 100 and printed circuit board 400. The powerand ground pads 110 a and 110 b, like interface pads 106 a-106 p, permitfor greater tolerance or mismatch in mating or interfacing powerconditioning module 100 to board 400. The power and ground pads 110 aand 110 b may be designed and fabricated in the same manner as interfacepads 106 a-106 p.

[0080] The power conditioning module 100 also includes electricalcircuitry 112. The electrical circuitry 112 delivers the conditionedpower to device 200. In particular, electrical circuitry 112 providesappropriate conditioning of the voltage parameters (for example, supplyvoltage and ground) and current parameters (for example, supply, peakand typical operating currents) required by device 200 so that thevoltage and current available to device 200 during, for example, normaloperation, standby, start-up and/or shutdown, are within the ranges ortolerances required for proper and reliable operation. The electricalcircuitry 112 may include voltage regulators, bypass capacitors, DC-DCconverters, and/or AC-DC converters arranged, configured, designed andinterconnected using conventional techniques and designs (for example,conventional CMOS or BJT design and fabrication techniques). A briefoverview of these elements is provided in the background of theinvention and, for the sake of brevity, will not be repeated here.

[0081] Importantly, by locating electrical circuitry 112, such asvoltage regulators, bypass capacitors, ferrite beads, DC-DC converters,and/or AC-DC converters near device 200, the considerations identifiedabove regarding power conditioning are addressed. In addition, thehorizontal and vertical space consumed by electrical circuitry 112 isconsiderably reduced in relation to the conventional techniques andsystems illustrated in FIG. 1 and contemplated in U.S. Pat. No.6,285,550. Moreover, locating power conditioning module 100 on or nearthermal management module 300 facilitates efficient capture andrejection of heat generated by electrical circuitry 112 in powerconditioning module 100.

[0082] The electrical circuitry 112 illustrated in FIG. 2 is disposed onthe first interface of substrate 102. This embodiment may facilitateinterfacing with the electrical power and ground inputs of device 200.However, it should be noted that electrical circuitry 112 may also bedisposed on the second interface as illustrated in FIG. 4. Thisconfiguration may, for example, enhance the thermal capture andrejection capabilities with respect to the electrical circuitry of powerconditioning module 100 and enhance signal conductivity between device200 and signal traces on printed circuit board 400. In addition, theconfiguration illustrated in FIG. 4 may also suite the packagingrequirements of device 200 and reduce the thermal exchange between powerconditioning module 100 and consuming device 200. The embodiment of FIG.4 may also accommodate manufacturing constraints of electrical circuitry112 of power conditioning module 100.

[0083] The electrical circuitry 112 may also be disposed on both thefirst and second interfaces. A layout having electrical circuitry 112disposed on the first and second interfaces may provide many of theadvantages of both FIGS. 3 and 4.

[0084] While it is contemplated that the power conditioning requirementsof device 200 are satisfied by power conditioning module 100, it shouldbe noted that additional discrete electrical power conditioning elements(for example, by-pass capacitors (not shown) to provide filtering, inaddition to that performed by power conditioning module 100, also may beemployed and disposed in manners similar to that of conventionalsystems. Under this circumstance, power conditioning module 100 does notperform all power conditioning functions of system 10. Rather, powerconditioning module 100 performs power conditioning in conjunction withdiscrete electrical power conditioning elements. These discreteelectrical power conditioning elements may perform initial and/orsupplemental conditioning of the voltage and current. For example, asystem may include a primary power supply (having discrete components)to provide initial power conditioning of an externally supplied power.The power conditioning module 100, in turn, provides localized powerconditioning of the power for device 200. In this embodiment, theprimary power supply may provide initial power conditioning for aplurality of devices in the system, including device 200 (See, forexample, FIG. 24). Thus, many of the advantages of power conditioningmodule 100 are still realized, however, the additional discreteelectrical power conditioning elements may increase the footprint of thepower conditioning of the overall system.

[0085] The reference voltages and currents used by electrical circuitry112 may be provided or routed to the particular elements (for example,voltage regulators) of electrical circuitry 112 in many ways. Forexample, with reference to FIG. 5, in one embodiment, the voltage andcurrent may be provided to electrical circuitry 112 using power andground conduits 114 a and 114 b that are embedded within semiconductorsubstrate 102. The power and ground conduits 114 a and 114 b extend frompower and ground vias 108 a and 108 b and connect to electricalcircuitry 112 as dictated by the specific power conditioning circuitdesign implemented. In this embodiment, power and ground vias 108 a and108 b need not extend the entire length of semiconductor substrate 102(as illustrated in FIG. 2) since power and ground conduits 114 a and 114b connect well within substrate 102. The power and ground conduits 114 aand 114 b may be fabricated using conductive materials (for example,gold, copper, aluminum or a highly doped polysilicon) and depositedusing conventional semiconductor processing or fabrication techniques(for example, conventional photolithography, etching and depositionprocesses).

[0086] With reference to FIG. 6, power and ground conduits 114 a and 114b may also be formed more towards the interface of semiconductorsubstrate 102 (but still in substrate 102). In this embodiment, powerand ground vias 108 and 108 b may extend the entire or nearly the entirelength of semiconductor substrate 102 since power and ground conduits114 a and 114 b connect to electrical circuitry 112 nearer the surfaceof the interface of substrate 102. The power and ground conduits 114 aand 114 b of FIG. 6 extend from power and ground vias 108 a and 108 b(not illustrated in FIG. 6) and connect to electrical circuitry 112which is also fabricated near the interface of substrate 102. The powerand ground conduits 114 a and 114 b may be fabricated using conventionalprocessing or fabrication techniques from conductive materials (forexample, gold, copper, aluminum or a highly doped polysilicon).

[0087] Another alternative for supplying power and ground to electricalcircuitry 112 is illustrated in FIGS. 4 and 7. In these embodiments,power and ground are provided to electrical circuitry 112 usingconventional wire bonding techniques that employ conventional wires 120and bond pads 122 as illustrated in FIG. 4. Those skilled in the artwill appreciate that there are many techniques for providing power andground connections from board 400 (or a power supply, not shown) toelectrical circuitry 112. All techniques for providing power and groundconnections to and from electrical circuitry 112, whether now known orlater developed, are intended to be within the scope of the presentinvention.

[0088] As mentioned above, electrical circuitry 112 conditions thepower, in a conventional manner, and delivers the required power todevice 200. The electrical circuitry 112 (for example, voltageregulators, bypass capacitors, DC-DC converters, and/or AC-DCconverters) may be arranged and interconnected using conventionaltechniques and designs (for example, conventional CMOS and/or BJTcircuit designs to accomplish the necessary power conditioningfunctions) to provide device 200 with the appropriate voltage andcurrent during all aspects of operation as well as during start-up,standby and shutdown.

[0089] The output power and/or ground of power conditioning module 100may be provided or routed to device 200 using techniques similar tothose used in providing electrical circuit 112 with the “unconditioned”power and ground from board 400 (or power supply, not shown). In thisregard, with reference to FIG. 5, in one embodiment, electricalcircuitry 112 supplies the conditioned power and/or ground to device 200using output power conduit 116 a, output ground conduit 116 b, outputpower via 118 a, and output ground via 118 b. Signal traces may thenprovide electrical connection between output power and ground conduits116 a and 116 b to power and ground inputs of device 200.

[0090] Alternatively, with continued reference to FIG. 5, output powerand output ground conduits 116 a and 116 b may be directly routed to thespecified pads on the interface of substrate 102 that match orcorrespond to the power and ground inputs of device 200. In thisembodiment, vias 118 a and 118 b may be eliminated because output powerand ground conduits 116 a and 116 b are routed to the appropriate powerand ground inputs of device 200 without an intermediate connection. Forexample, the output power and/or ground of power conditioning module 100may be routed to device 200 in the manner illustrated in FIG. 6.

[0091] With reference to FIG. 6, output power and ground conduits 116 a,116 b and 116 c are formed in substrate 102 using conventionalfabrication techniques and routed to a predetermined pads 106×, 106 yand 106 z which corresponds to power or ground inputs of device 200. Inthis embodiment, there may be no need for output power and ground vias118 a and 118 b since output power and ground conduits 116 a and 116 bare routed directly to specified pads 106 x, 106 y and 106 z on theinterface of substrate 102 that match or correspond to the power andground inputs of device 200. The power and ground conduits 116 a and 116b may be fabricated from electrically conductive materials (for example,gold, copper, aluminum or a highly doped polysilicon).

[0092] Further the output power and ground of power conditioning module100 may also be routed to device 200 in the manner illustrated in FIG.7. In this embodiment, output power and ground are provided to device200 using conventional wire bonding techniques. In short, conventionalwires 120 (and bond pads, not shown) interconnect the output of powerconditioning module 100 to the appropriate inputs of device 200.

[0093] It should be noted that power conditioning module 100 may befabricated using a 2-stage process, in which vias 104 and 108 (and otherelements, for example power and ground conduits 114 and 116) are formedfirst and electrical circuitry 112 fabricated using conventional CMOS orBJT processing is formed second. Indeed, it should be understood thatany techniques for fabricating (as well as the materials used therein)power conditioning module 100 now known or later developed are intendedto be within the scope of the present invention.

[0094] Moreover, it should also be noted that with respect to all of theembodiments described herein, those skilled in the art will recognizeand understand that there are many other suitable techniques forproviding the conditioned or output power and ground from electricalcircuitry 112 to device 200. Indeed, it should be understood that anytechniques for designing and fabricating the pads, vias, conduits,electrical circuitry and wire bonds now known or later developed areintended to be within the scope of the present invention; in addition,it should be understood that any materials used therein for thesubstrate, pads, vias, conduits, electrical circuitry, and wire bondswhich are now known or are later developed are intended to be within thescope of the present invention.

[0095] The present invention is advantageously suitable for use inspace-constrained environments. In this regard, locating the powerconditioning elements in essentially the same basic footprint as theintegrated circuit device permits the space around the integratedcircuit device to be used for other purposes. For example, externalstatic or dynamic memory may be located closer to the microprocessorthereby reducing the flight times of signals communicating with thememory. This may result in faster system operation.

[0096] The power conditioning module 100 may be located between device200 and board 400 as illustrated in FIG. 3. In this embodiment, aconfiguration of power conditioning module 100 as illustrated in FIG. 2is more suitable because the vias, among other things, facilitateelectrical connection for those signals used by device 200 (but not bypower conditioning module 100), for example data and address signals forDRAM or SRAM memory devices.

[0097] Alternatively, power conditioning module 100 may be locatedbetween device 200 and thermal management module 300 as illustrated inFIGS. 4 and 7. In light of the active electrical layer (for example,electrical circuitry 112) of power conditioning module 100 beingseparated from board 400, it is necessary to form discrete electricalconnections from the active electrical layer to board 400. As mentionedabove, this may be accomplished using wire bonds 120 as illustrated inFIGS. 4 and 7, or by using other known or later developed interconnecttechnologies, all of which are intended to be within the scope of thepresent invention.

[0098] Under certain circumstances, it may be advantageous to locatethermal management module 300 remotely from the other elements of system10. In this regard, thermal management module 300 may be a fan thatcauses air to travel over the elements of system 10 and thereby removethe heat generated by module 100 and device 200. Such a configurationfacilitates use of system 10 in a space-constrained environment yetprovides sufficient power conditioning in a small footprint. In thisembodiment, the remotely located thermal management module 300 may beplaced in an area having sufficient volume for a fan, withoutinterfering with other system needs for placement of peripherals, suchas memory or data storage, in close proximity to device 200.

[0099] Further, in certain implementations, it may be advantageous toimplement a more compact thermal management module 300 than aconventional fin-array heat sink as illustrated in FIG. 3. For example,as will be discussed below, it may be advantageous to employ a thermalcapture element having a micro channel structure to capture and removeheat generated by device 200 and/or electrical circuitry 112. The heatenergy may then be-rejected by a heat rejection element that is eitherlocal or remote relative to device 200. Indeed, it should be understoodthat any techniques known or later developed for heat capture andrejection apparatus or sub-system, including any of those describedherein, are intended to be within the scope of the present invention.

[0100] Finally, under certain circumstances, thermal management module300 may be unnecessary altogether For example, the introduction of “coolchips” such as the “Crusoe” processor from Transmeta Inc., feature lowthermal profiles. As such, system 10 may be implemented in aspace-constrained environment (for example, portable or handhelddevices), due to its small footprint, and be unconcerned with thermalcapabilities and space considerations of thermal management module 300.

[0101] In another aspect, the present invention is an integrated powerand thermal management module that incorporates the functions of thepower conditioning element (i.e., power conditioning) and the thermalmanagement element (i.e., heat capture, removal and/or rejection) into asingle structure. In contrast, in the previously discussed embodiments,the modules for power conditioning and heat capture, removal andrejection were separate structures that were stacked, with device 200,in various configurations to form a 3-layer structure. In this aspect ofthe invention, the power conditioning element and the thermal managementelement are incorporated into a single structure. As such, additionaladvantages (beyond those advantages described above) may be realizedincluding, for example, a significant reduction in the total volumeoccupied and direct physical contact may be achieved between theconsuming device, the power conditioning module and the thermalmanagement module—thereby facilitating enhanced thermal capture andrejection for the power conditioning structure and/or the consumingdevice.

[0102] This aspect of the invention also provides unique packagingconfigurations of the combined power conditioning and thermal managementmodule—consuming device structure. It should be noted that since theconsuming device and the power conditioning module capitalize on thethermal management capabilities of the integrated power conditioning andthermal management module, additional heat capture and rejectionelements may be unnecessary. This may be important because, in someinstances, the operational temperatures of the power conditioning modulemay approach that of device 200.

[0103] Moreover, “miniaturizing” the thermal management elementfacilitates implementation of the integrated power conditioning andthermal management module in highly space-constrained environments.Where the heat capture and heat rejection aspects of the thermalmanagement element of module 1000 are separated such that the thermalcapture functions are integrated into a single structure with the powerconditioning functions, that single structure (i.e., power conditioningand thermal management module 1000 as in FIG. 8) may be implementedwithin the packaging of an integrated circuit device. (See, for example,FIG. 11). The heat rejection functions may be accomplished using a heatsink disposed on a surface of the device/package or located distant fromthe device/package.

[0104] With reference to FIGS. 8 and 9, power conditioning and thermalmanagement module 1000 includes power conditioning element 1100. Thepower conditioning element 1100 may be substantially similar to powerconditioning module 100 of FIGS. 2-7 and may include, for example, vias,pads, and electrical circuitry as described above. For the sake ofbrevity, the details and functions of power conditioning element 1100will not be repeated here.

[0105] The power conditioning and thermal management module 1000 alsoincludes thermal management element 1200. Thermal management element1200 captures and removes the heat generated by device 200 and/or powerconditioning element 1100 so that the temperature of device 200 and/orpower conditioning element 1100 does not exceed a given temperature. Thethermal management element 1200 may also reject the heat. Thus, inoperation, thermal management element 1200 captures the heat generatedby device 200 and power conditioning element 1100 and removes that heatso that it may be dispersed in the surrounding environment by convectionor a heat rejection element (for example, a conventional heat sink).

[0106] Power conditioning and thermal management module 1000 may includesubstrate 102 a, in which a substantial portion of power conditioningelement 1100 is formed, and substrate 102 b, in which a portion ofthermal management element 1200 is formed. The two substrates may bebonded by, for example, anodic or fusion bonding, or eutectic bonding,or adhesive bonding for glass and semiconductor structures. Employingmetal structures permits bonding by welding, soldering, eutecticbonding, or adhesives. The combined substrates 102 a and 102 b formpower conditioning and thermal management module 1000.

[0107] In this configuration, interface vias that provide electricalconnection between signal traces on printed circuit board 400 andinputs/outputs of device 200 may be fabricated in two steps. A separateset of interface vias are formed in each of the substrates of powerconditioning element 1100 and thermal management element 1200.Thereafter, when the two substrates are bonded, a corresponding one ofthe interface vias in substrate 102 a mates with a corresponding one ofthe interface vias in substrate 102 b to form the interface via formodule 1000.

[0108] To enhance the electrical continuity between the interface viasin substrate 102 a and 102 b, intermediate interface pads may bedisposed on each of the mating interfaces of substrate 102 a and 102 b.The pads on each mating interface, after the two substrates are bonded,contact a corresponding pad on the other mating interface. Thisconfiguration allows for greater tolerance when mating or interfacingpower conditioning element 1100 and thermal management element 1200 and,as such, may enhance the electrical continuity between the exposedinterfaces of power conditioning and thermal management module 1000 whenthe bonded substrates are not perfectly aligned.

[0109] Moreover, in those instances where external power is provided topower conditioning element 1100 by way of power and ground vias, thesame fabrication techniques described above may be employed to fabricatethe power and ground vias. However, in those instances where externalpower is provided to power conditioning element 1100 by way of wirebonds, power and ground vias may not be necessary.

[0110] With continued reference to FIGS. 8 and 9, in one embodiment,thermal management element 1200 includes a micro channel heat exchanger1210 having a plurality of micro channels 1220. The micro channel heatexchanger 1210 also includes pump 1230, fluid inlet 1240, fluid outlet1250, and tubing 1260 to provide a fluid to micro channels 1220.

[0111] With reference to FIGS. 10A and 10B, micro heat exchanger 1210may be, for example, a micro fabricated semiconductor substrate,machined metal substrate, or machined glass substrate. FIGS. 10A and 10Billustrate a top and cross sectional view, respectively, of an exemplarymicro channel structure 1220. The substrate of thermal managementelement 1200 includes a pattern of micro channels 1220-1 and 1220-2etched into an interface. The micro channels 1220-1 and 1220-2 may bearranged on the interface of thermal management element 1200 accordingto the needs for heat removal from particular regions of powerconditioning element 1100. The density of micro channel structure 1220may be increased in regions that correspond to anticipated or measuredsources of excessive heat, or the routing of micro channels 1220-1 and1220-2 may be designed to reduce and/or minimize temperature gradientsfrom the inlet to the outlet of micro heat exchanger 1210. The widths,depths, and shapes of micro channels 1220-1 and 1220-2 may also bedesigned and fabricated to improve device temperature uniformity oraddress a hot spot on device 200 and/or power conditioning element 1100.Indeed, the shape and arrangement of micro channel structure 1220 may bedesigned or determined through the assistance of thermal modeling toolsdescribed in a U.S. patent application entitled “ElectroosmoticMicrochannel Cooling System”, filed by Kenny, et al. on Jan. 19, 2002.Many different types of arrangements, layouts and configurations ofmicro heat exchanger 1210 and micro channels 1220-1 and 1220-2 aredescribed and illustrated in the U.S. patent application filed by Kennyet al. on Jan. 19, 2002.

[0112] The U.S. patent application filed by Kenny et al. on Jan. 19,2002 (entitled “Electroosmotic Microchannel Cooling System”) has not yetbeen assigned an Application Serial Number. The Kenny et al. U.S. patentapplication will be referred to hereinafter as “the Kenny et al.Application”). The Kenny et al. Application is hereby incorporated, inits entirety, by reference herein.

[0113] It should be noted that micro channels 1220 may also extend intothe interface of power conditioning element 1100 as well. In addition,micro channel structure 1220 may be formed on both the first and secondmating interfaces of thermal management module 1100. In this embodiment,micro heat exchanger 1210 may more efficiently capture and remove heatfrom both device 200 and power conditioning element 1200 due, in part,to more intimate physical contact between the heat exchanger 1210 andboth device 200 and power conditioning element 1200.

[0114] The micro heat exchanger 1210 may-also include more than onefluid path, as illustrated in FIG. 10A, by micro channels 1220-1 and1220-2. These independent paths may be connected to different pumps 1230and/or different heat rejection elements 1410, according to theparticular needs and/or designs of the application. As mentioned above,many different types of arrangements, layouts and configurations ofmicro heat exchanger 1210 and micro channels 1220-1 and 1220-2,including the multiple independent micro channel configuration, aredescribed and illustrated in the Kenny et al. Application, which areagain hereby incorporated by reference.

[0115] The pump 1230 may be any type of pumping device that provides theflow and pressure necessary to capture the heat generated in device 200and/or power conditioning element 1100. In this regard, pump may be anelectro-osmotic type pumping device like that described and illustratedin the Kenny et al. Application. The electro-osmotic type pumping deviceis not discussed in detail here, rather the corresponding discussion inthe Kenny et al. Application is incorporated herein by reference.

[0116] The power conditioning and thermal management module 1000 ofFIGS. 8 and 9 facilitates efficient packaging of power conditioningelement 1100 in close proximity to device 200, and provides anadditional advantage that the heat generated by power conditioningelement 1100 and/or device 200 is captured within, and removed bythermal management element 1200. Further, by positioning the powerconditioning and heat capture elements within a single module beneathdevice 200, a surface (for example, the top or upper surface) of device200 is available for other modes of access, such as optical or RFtelecommunications, and/or for placement of memory devices. Thispositioning also permits that surface of device 200 to be used for otherfunctions, including, for example, additional thermal managementelements such as a heat sink as illustrated in FIG. 3 or a secondthermal management element as illustrated in FIGS. 17A and 17B.

[0117] In addition, power conditioning and thermal management module1000 of FIGS. 8 and 9 facilitates efficient packaging as a discretedevice. In this regard, with reference to FIGS. 11 and 12A, module 1000may be incorporated into a typical electronic package 1300, having pins1310, that is modified to accommodate fluid required for thermalmanagement element 1200.

[0118] The device 200 illustrated in the embodiment of FIG. 11 mayemploy a conventional face-down, ball-bond mounting configuration to anelectrical interconnect array. The device 200 may be mounted to powerand thermal management module 1000 in a manner similar to that describedabove with respect to the embodiment illustrated in FIGS. 2-7. Employinga face-down, ball-bond mounting configuration for device 200 providesseveral additional advantages, including, for example, providingintimate contact between device 200 with the heat capture capabilitiesof thermal management element 1200 (and the fluid-filled micro channels1220); and permitting back-surface access to device 200 for otherpurposes, as described above.

[0119] The device 200 illustrated in the embodiment of FIG. 12A mayemploy a conventional face-up, wire bond mounting configuration wherewire bonds provide connection from device 200 to package 1300. In thisembodiment, the interconnect vias are unnecessary since conventionalwire bonding techniques provide the electrical connection to device 200.However, this embodiment provides several significant advantages,including, for example, incorporation of power conditioning and heatcapture elements into package 1300 thereby providing close proximity ofpower conditioning element 1100 to device 200. In addition, thisembodiment provides an advantage of providing intimate contact betweendevice 200, power conditioning element 1100 and thermal managementelement 1200 so that energy (in the form of heat) generated by device200 and/or power conditioning element 1100 may be efficiently captured(by the fluid in micro channels 1220) are removed from package 1300. Afurther advantage of the embodiment in FIG. 12A is that the operatingsurface of device 200 is optically accessible, which would be suitablefor use by another device, for example, an electro-optic device, such asa modulator, a display device, an optical imaging device, such as a CCD,and/or an optical switch.

[0120] Under those circumstances where device 200 is to be implementedin a harsh environment, it may be advantageous to hermetically-sealpackage 1300. As illustrated in FIG. 12B, a lid 1320 may be attached topackage 1300 thereby providing a hermetically-sealed environment withintegrated power conditioning and thermal management capabilities ofmodule 1000 in intimate contact with device 200. The lid 1320 may beopaque, as would be appropriate for an opto-electronic device, or lid1320 may be transparent in the infrared or visible spectrums, as wouldbe appropriate for a display device, or an imaging device. Integrationof the power and thermal management functions within this package mayallow optimal operation of thermally-sensitive devices, such as imagingarrays.

[0121] Under those circumstances where device 200 is to be mounteddirectly onto a substrate (for example, printed circuit board 400), itmay be advantageous to supply the working fluid to thermal managementelement 1200 by way of channels fabricated in the substrate to which themodule 1000 is affixed. With reference to FIG. 13, the working fluid isprovided to micro heat exchanger 1210 from beneath power conditioningand thermal management module 1000 using channels or tubing 1260 thatare embedded or formed in the substrate. Press fits, solder and/oradhesives may secure the channels or embedded tubing 1260 directly tofluid inlet (not shown) and fluid outlet (not shown) of micro heatexchanger 1210. The configuration of FIG. 13 may facilitateimplementation of module 1000 in a chip pick-place assembly process.

[0122] It should be noted that there are many possible techniques ofattaching channel or tubing 1260 to module 1000, including, for example,formation of openings in module 1000 to permit tubing segments and/orother couplings to be inserted into module 1000 and bonded into place.These bonds may be press-fits, or utilize solder or adhesives.Alternatively, it is possible to form openings in module 1000 on the topor bottom surfaces, and to bond a fitting to one or both of thesesurfaces over the opening(s) with a port for connecting the tube.Indeed, all techniques, now known or later developed, for securingembedded channels or tubing 1260 to the fluid inlet and outlet of microheat exchanger 1210 are intended to be within the scope of the presentinvention.

[0123] The embedded channel configuration of FIG. 13 also may beemployed in those circumstances where the consuming device and powerconditioning and thermal management module 1000 are packaged and thatpackage is affixed to a substrate. As illustrated in FIG. 13, theworking fluid may be provided to the micro heat exchanger of powerconditioning and thermal management module using channels or tubing thatare embedded or formed in the substrate to which the consuming device isaffixed. The fittings may be employed to secure the channels (orembedded tubing) directly to the fluid inlet and outlet of the microheat exchanger or the fluid inlet and outlet of the package. In thosecircumstances where the channels (or embedded tubing) are connected tothe fluid inlet and outlet of the package, tubing or channels embeddedor formed in the package may provide the interconnection between thechannels (or tubing) in the substrate and the fluid inlet and outlet ofthe micro heat exchanger.

[0124] The power and thermal management module 1000 may also includecircuits or devices that provide information regarding the operatingparameters of module 1000 for more efficient and responsive cooling andpower conditioning. With reference to FIGS. 14 and 15, power and thermalmanagement module 1000 of this embodiment additionally includes sensors1270 (for example, temperature, pressure and flow sensors) andcontroller 1280. The sensors 1270 provide information that isrepresentative of the operating conditions of device 200 and module 1000(for example, operating temperature). The signals from sensors 1270 maybe routed to controller 1280 to provide a closed-loop control of thefunctionality of power and thermal management module 1000.

[0125] In particular, where sensors 1270 include a temperature measuringsensor, controller 1280 may use information provided by the temperaturesensor to modify or adjust the operation of thermal management element1200, power conditioning element 1100 and/or device 200. Under thesecircumstances, power conditioning and thermal management module 1000 isbeing operated in a thermal control mode, in which the temperaturevariations measured by one or more temperature sensors that aredistributed throughout module 1000 are provided as feedback signals tocontroller 1280. The controller 1280 may use the information provided bysensors 1270 to determine, for example, the average temperature ofmodule 1000 and/or device 200 and spatial variations in temperature withrespect to module 100 and/or device 200. In response to thisinformation, controller 1280 may adjust the fluid flow rate throughmicro channels 1220 of micro channel heat exchanger 1210. The controller1280 may adjust the rate of fluid flow in micro channels 1220 bycontrolling the operation of pump 1230 or by adjusting the distributionof the fluid through the different channel manifolds of micro channelheat exchanger 1210.

[0126] In addition, controller 1280, after determining a temperaturesensitive condition, may alert device 200 that it may exceed (or hasexceeded) its normal operating temperature. In response device 200 mayinitiate a low power mode in order to lower its operating temperatureand power consumption. Consuming less power will result in less heatgeneration by device 200 as well as power conditioning element 1100. Thedevice 200, in response to information regarding its operatingtemperature, may enter a system shut down process as a protectivemeasure. Other actions in response to changes in temperature aredescribed in the Kenny et al. Application, which are hereby incorporatedby reference herein.

[0127] The placement or location of sensors 1270 (for example,temperature, pressure, and/or flow sensors) within substrates 102 a and102 b may be based on many factors. For example, there may be advantagesto place the temperature sensors laterally with respect to the microchannels 1220 and the anticipated or measured sources of heat ofelectrically circuitry 112 and/or device 200. Moreover, there may beadvantages to placement of temperature sensors at different depths(vertical locations) in substrates 102 a and 102 b. FIGS. 10A, 10B, 14and 15 illustrate sensors 1270 disposed in various locations in powerconditioning element 1100 and thermal management element 1200. Thesensors 1270 provide information indicative of the operating conditions(for example, temperature) of a specific region(s) of device 200 andmodule 1000 to controller 1280.

[0128] A detailed discussion of sensors 1270, their operation, andconsiderations regarding their placement or location, is provided in theKenny et al. Application, which is hereby incorporated by referenceherein.

[0129] It should be noted that although the embodiments of FIGS. 9 and15 illustrate one pump, namely, pump 1230, power and thermal managementmodule 1000 may include more than one pumping mechanism. Additionalpumping mechanisms may be implemented to provide more immediate anddirect control of fluid flow in particular regions of module 1000. Thismay be important in those situations where there are expected hotspotsin device 200 and/or power conditioning elements 1100. For example, morethan one pump ray be implement in configuration where micro heatexchanger 1210 includes separate and independent micro channels 1220paths, as illustrated in FIG. 10A. Additional embodiments employing morethan one pumping mechanism are described in detail in the Kenny et al.Application, which is hereby incorporated by reference herein.

[0130] Thus, to briefly summarize, power and thermal management module1000 of FIG. 15, provides, among other things, power conditioningfunctions for device 200, and cooling functions for maintaining device200 and/or power conditioning elements 1100 within acceptabletemperature ranges. The controller 1280, in conjunction with sensors1270, permits analysis and detection of changes in the operatingparameters of device 200 and power and thermal management module 1000.Such changes may result from changes in the power usage by device 200.In response, thermal management element 1200 may adjust the coolingcapability (by, for example, control signals to the fluid pump(s) toincrease the rate of fluid flow) in order to maintain the temperature ofdevice 200 within acceptable temperature ranges.

[0131] The power and thermal management module 1000 may also includecurrent sensors to detect the current consumption of device 200. Withreference to FIG. 16, current sensor 1290 may be embedded insemiconductor substrate 102 a to provide information which isrepresentative of the current consumption of device 200 and/orelectrical circuitry 112 to controller 1280. The controller 1280 may usethe detected current consumption to modify the operation of thermalmanagement element 1200. For example, in response to a change in demandof current detected by current sensor 1290, controller 1280 may adjustthe fluid cooling capability of thermal management element 1200 byincreasing or decreasing the fluid flow of pump 1230. In thisembodiment, by detecting and analyzing changes in current demand bydevice 200, controller 1280 may anticipate a change in temperature ofdevice 200 and/or power conditioning element 1100.

[0132] With continued reference to FIG. 16, current sensor(s) 1290 mayalso detect the current passing through electrical circuitry 112 ofpower conditioning element 1100 (for example, the voltage regulationdevices). The current passing through electrical circuitry 112 may berepresentative of the current and/or power consumption or demand ofdevice 200. The controller 1280 may use the information from sensor(s)1290 to determine appropriate actions to be taken in anticipation of anincrease or decrease in temperature as a result of a change in thecurrent consumption of device 200 and/or power conditioning element1100. The controller may also use that information to determineanticipated heat capture and rejection requirements as a result of achange in the current consumption.

[0133] Based on a measurement of the current through the voltageregulation circuits, it may be possible to determine the powerconsumption in the voltage regulators and/or the power dissipation indevice 200, thereby enabling controller 1280 to determine the totalpower dissipation and adjust the heat capture and removal capabilitiesof micro channel heat exchanger 1210 accordingly. The heat capture andremoval capabilities of micro channel heat exchanger 1210 may bemodified by altering the rate of flow of the working fluid in microchannels 1220 (for example, by adjusting the output flow rate of pump1230). Further, controller 1280 may also adjust the heat rejectioncapabilities after the heat is captured and removed from device 200 andmodule 1000. Other techniques for changing the heat capture and removalcapabilities of micro channel heat exchanger 1210 are described in theKenny et al. Application, which are hereby incorporated by reference.

[0134] In the embodiment of FIG. 16, sensor(s) 1290 are integrated withthe voltage regulators in power conditioning element 1100. It should benoted that controller 1280 may also determine the power requirementsand/or consumption of device 200 indirectly from the power consumedduring operation of device 200. The controller 1280 may then use thatinformation to determine or implement an appropriate course of action,for example, by adjusting the heat capture and removal capabilities ofmicro channel heat exchanger 1210 or heat rejection capabilities of thesystem, as discussed above.

[0135] Moreover, it should be noted that the functions/operationsperformed by controller 1280 may be implemented within device 200. Underthis circumstance, device 200 determines its power consumption using,for example, information from sensors 1270 (for example, temperature,pressure, flow) and/or current sensor 1290, or information regardingclock rate, electrical activity in subsystems such as floating-pointprocessors, image processing circuits, and analog current outputcircuits. In response, device 200 may adjust the power deliverycapabilities of power conditioning element 1100. The device 200 may alsoadjust the heat capture, removal and/or rejection capabilities ofthermal management element 1200. Employing device 200 to perform some orall of the functions/operations previously performed by controller 1280facilitates use of information typically available to devices (forexample, clock rate), as well as use of computational resources that mayalready exist in device 200.

[0136] In addition, for devices that execute repetitive or predictablefunctions, it may be possible to predict variations in the powerconsumption of devices, and to use thermal dynamic models of the entiresystem to produce an optimal or enhanced strategy for heat capture andrejection management that minimizes temporal or spatial variations inthe temperature within device 200. The device 200 and/or controller 1280may implement sophisticated control algorithms that allow device 200and/or controller 1280 to determine an appropriate action or response ofthermal management element 1200 so that the temperature of device 200and/or power conditioning element 1100 is maintained within a narrowrange. That information may be used to develop a heat capture/rejectionoperational procedure that achieves an optimal balance betweentemperature variations of device 200 and operational costs of power andthermal management module 1000. Such operational costs may be powerconsumption by device 200, computational complexity, and/or operationwithin preferred flow and thermal ranges.

[0137] Moreover, device 200 and/or controller 1280 may use informationindicative of the operation of device 200 to predict variations in thespatial distribution of the power dissipation within device 200. Forexample, if device 200 is a microprocessor, the power consumption of thefloating point processor, which takes up a small fraction of theprocessor's surface, may temporarily exceed the power consumption of theremainder of the microprocessor. In such a case, the temperature of thissubsystem of the microprocessor may rise rapidly to temperatures thatexceed the recommended operational temperatures. Thus, it may beadvantageous for device 200 and/or controller 1280 to predict theconcentrated power dissipation in device 200 and, in response, providethe necessary heat capture capabilities dynamically to thoseconcentrated power dissipation regions of device 200.

[0138] In another aspect, the present invention is a closed-loop powerconditioning and thermal management system. With reference to FIG. 17A,in one embodiment, closed-loop power conditioning and thermal managementsystem 2000 includes power conditioning and thermal management module1000, as discussed above, in conjunction with thermal capture andrejection module 1400. In this embodiment, power conditioning andthermal management module 1000 is disposed on printed circuit board 400,device 200 is disposed on power conditioning and thermal managementmodule 1000, and thermal capture and rejection module 1400 is disposedon device 200. In this configuration, power conditioning element 1100 ofpower conditioning and thermal management module 1000 is disposed inclose proximity to device 200 thereby providing the power conditioningadvantages described above. Moreover, micro channel heat exchanger 1210is disposed in close proximity to power conditioning element 1100thereby facilitating enhanced heat capture, removal and rejection inorder to maintain the temperature of power conditioning element 1100within an acceptable range. The heat captured by thermal managementelement 1200 is provided (via fluid flow) to heat rejection element 1410of thermal capture and rejection module 1400.

[0139] The thermal capture and rejection module 1400 rejects the heatprovided by thermal management element 1200 using heat rejection element1410, which is illustrated as a heat sink having fins, and thermalcapture element 1420. The heat rejection element 1410 may employ manydifferent types of heat rejection techniques, including a design havinga fluid flow path or paths throughout the high-surface-area structures(such as fluid channels in the fins) as described and illustrated in theKenny et al. Application. All of the thermal capture, removal andrejection techniques described and illustrated the Kenny et al.Application are hereby incorporated by reference.

[0140] Thermal capture element 1420 includes a micro channel heatexchanger 1430 which facilitates localized heat capture, removal and, inconjunction with heat rejection element 1410, rejection of heatgenerated primarily by device 200. The micro channel heat exchanger 1430includes a plurality of micro channels 1440 (which, in operation containa fluid) for efficient heat capture from device 200. The micro channelheat exchanger 1430, including micro channels 1440, may be fabricated inthe same manner and using the same materials as micro heat exchanger1210 and micro channels 1220.

[0141] The micro channel heat exchanger 1430 may be, for example,arranged at the interface of thermal capture element 1420 in accordancewith the needs for heat removal from particular regions of device 200.The density of micro channels 1440 may be increased in regions thatcorrespond to anticipated or measured sources of excessive heat. Inaddition, the routing of micro channels 1440 may be designed to reduceand/or minimize temperature gradients from the inlet to the outlet ofmicro heat exchanger 1420. The widths, depths, and shapes of microchannels 1440 may also be designed and fabricated to improve devicetemperature uniformity across device 200. Indeed, the shape and layoutof micro channels 1440 may be designed through the assistance of thermalmodeling tools described in the Kenny et al. Application. Many differenttypes of arrangement, layouts, configurations and design techniques ofmicro heat exchanger 1420 and micro channels 1440 are described andillustrated in the Kenny et al. Application, which are herebyincorporated, in total, by reference.

[0142] Similar to description above relative to thermal managementmodule 1200, the micro channels of micro heat exchanger 1420 may bedisposed on both interfaces of thermal capture element 1420 to enhancethe thermal capture, removal and/or rejection from the heat generatingdevice(s). Moreover, it should be noted that micro channel heatexchanger 1430 may be configured as an array of micro channel pillars.In this regard, an array of vertical channels are interconnectedlaterally on an interface (or on both interfaces) of thermal captureelement 1420. This configuration may further enhance the thermalcapture, removal and/or rejection of heat energy generated by device 200and/or power conditioning and thermal management module 1000.

[0143] With continued reference to FIG. 17A, in this embodiment, pump1230 is disposed between thermal capture and rejection module 1400 andheat rejection element 1410. The pump 1230 may be an electro-osmoticpumping device as described in detail in the Kenny et al. Application.Many different types of configurations and designs of pump 1230 areacceptable including those described and illustrated in the Kenny et al.Application, which are hereby incorporated by reference.

[0144] It should be noted that system 2000 may employ multiple pumpsand/or independent fluid cooling loops to allow for independent controlof the heat capture capabilities at different locations within module1000. This feature is also discussed in detail in the Kenny et al.Application, and is also hereby incorporated by reference.

[0145] With reference to FIG. 17B, under certain circumstances, it maybe advantageous to locate heat rejection element 1410 remotely from theother elements of system 2000. Such a configuration facilitates use ofsystem 2000 in a space-constrained environment yet provides sufficientpower conditioning and thermal management in a small footprint. Whereheat rejection element 1410 is located remotely, tubing 1260 provides afluid path for fluid heated by device 200 and power conditioning element1210 to heat rejection element 1410. In this embodiment, the remotelylocated heat rejection element 1410 may be placed in an area havingsufficient volume for a fin array (and possibly with a fan), withoutinterfering with other system needs for placement of peripheral systemelements such as memory or data storage in proximity to device 200.Indeed, as mentioned above, under certain circumstances, heat rejectionfunctionality may be unnecessary altogether.

[0146] The power conditioning and thermal management module 1000 ofFIGS. 8-17B illustrate the power conditioning element disposed on thethermal management element. In the embodiment of FIG. 18, however,thermal management element 1100 is disposed on power conditioningelement 1200. In this embodiment, thermal management element 1200 maymore efficiently capture and remove heat generated by device 200 becauseof the proximity of the micro channels to device 200. Moreover, thecapture and removal of heat from electrical circuitry 112 of powerconditioning element 1100 may remain relatively unchanged. Thus, thermalmanagement element 1200 may more efficiently capture and remove heatgenerated by both device 200 and power conditioning element 1100.Accordingly, in this embodiment, there may be no need to incorporate aheat rejection element (for example, a heat sink, not shown) because ofthe heat capture and removal functions performed by thermal managementelement 1100.

[0147] It should be noted that, like in the embodiment illustrated inFIG. 8, micro channels 1220 (illustrated in FIG. 18) may also extendinto the interface of power conditioning element 1100. In addition,micro channel structure 1220 may be formed on both the first and secondmating interfaces of thermal management module 1100. Under thiscircumstance, micro heat exchanger 1210 may even more efficientlycapture and remove heat from both device 200 and power conditioningelement 1200 due, in part, to more intimate physical contact of the heatexchanger 1210 with both device 200 and power conditioning element 1200.

[0148] In addition to the thermal consideration, the electricalcircuitry of the power conditioning element remains in close proximitywith the device thereby providing all of the power conditioningadvantages described above.

[0149] The power conditioning and thermal management module 1000 of FIG.18 may be fabricated and implemented in the same manner as the powerconditioning and thermal management module 1000 illustrated in FIG. 8.In addition, power conditioning and thermal management module 1000 ofFIG. 18 may include all of the features, additions, attributes, andembodiments of power conditioning and thermal management module 1000 ofFIGS. 8-17B. In this regard, power conditioning and thermal managementmodule 1000 of FIG. 18 may include, for example, a controller, parametersensor(s) (for example, temperature, pressure and flow) to measure ordetect the operating conditions of device 200 and/or power conditioningelement 1200, and current sensor(s) to monitor the current consumed bydevice 200 and/or power conditioning element 1200. The powerconditioning and thermal management module 1000 of FIG. 18 may alsoinclude pump(s) to provide working fluid to the micro channels,including for example, electro-osmotic pump(s) having a small footprintto facilitate incorporation of the module in a space-constrainedenvironment. The power conditioning and thermal management module 1000of FIG. 18 may also include multiple independent micro channels to allowindependent thermal capture and removal of designated areas of device200 and/or power conditioning element 1200.

[0150] Moreover, power conditioning and thermal management module 1000of FIG. 18 may be implemented in the packaging configurations of FIGS.11, 12A and 12B in essentially the same manner as the embodiment of FIG.8. Indeed, all of the features and attributes of power conditioning andthermal management module 1000 illustrated in FIGS. 8-17B, and describedabove, are equally applicable to the power conditioning and thermalmanagement module of FIG. 18. For the sake of conciseness, the detailsof the features and attributes of the embodiments will not be repeatedhere.

[0151] With continued reference to FIG. 18, power conditioning andthermal management module 1000 may route the signals to and from device200 using all of the same techniques as described above with respect toFIGS. 2-17B. Moreover, power and ground may be routed to and fromelectrical circuitry 112 and device 200 using those same techniques. Forexample, the embodiment of FIG. 18 may employ the routing techniquedescribe in the embodiment of FIG. 6 wherein the output power and groundconduits are formed in substrate using conventional fabricationtechniques and are routed to predetermined pads which corresponds topower or ground inputs of device 200. Under this circumstance, outputpower and ground conduits are routed directly to the power and groundinputs of device 200.

[0152] In yet another embodiment, the power conditioning element and themicro channel structure of the thermal management element are fabricatedin the same substrate—rather than two substrates 102 a and 102 b, asdescribed above and illustrated in FIGS. 8 and 18. With reference toFIG. 19A, micro channel structure 1210 and power conditioning element1100 are fabricated in the same substrate. In this embodiment, theassembly costs may be reduced because the thermal management element andthe power conditioning element need not be assembled from two separatesubstrates before interfacing with the consuming device and anothersubstrate (for example, a printed circuit board). In addition, thecapture and removal of heat from the consuming device may be enhanced,relative to the embodiment of FIG. 9, because of the proximity of themicro channels to the heat generating circuitry disposed on theconsuming device. Moreover, the capture and removal of heat fromelectrical circuitry 112 of power conditioning element 1100 may besufficient and, as such, this embodiment may not require additional heatremoval, capture and rejection capabilities from, for example a heatsink and/or fan.

[0153] With continued reference to FIG. 19A, in this embodiment, microchannel structure 1210 of thermal management element 1200 may befabricated using conventional micro channel fabrication techniquesand/or those techniques described and illustrated in the Kenny et al.Application, which are hereby incorporated by reference. Thereafter,electrical circuitry 112 of power conditioning element 1100 may befabricated using conventional CMOS or BJT design and fabricationtechniques. In this embodiment, the interface, power and ground vias maybe fabricated before or after the formation of the micro channelstructure. The pads (if any) that connect to the vias may be fabricatedafter fabrication of electrical circuitry 112 and micro channels 1220.

[0154] It should be noted that all of the features, attributes,alternatives and embodiments of power conditioning and thermalmanagement module 1000 that include multiple substrates (i.e., 102 a and102 b) are fully applicable to the embodiment of FIG. 19A. In thisregard, power conditioning and thermal management module 1000 of FIG.19A may include, for example, a controller, parameter sensor(s) (forexample, temperature, pressure and flow), and current sensor(s). Thepower conditioning and thermal management module 1000 of FIG. 19A mayalso include pump(s) and multiple independent micro channels to allowindependent thermal capture and removal of designated areas of device200 and/or power conditioning element 1200.

[0155] Moreover, power conditioning and thermal management module 1000of FIG. 18A may be implemented in the packaging configurations of FIGS.11, 12A and 12B. Indeed, all of the features and attributes of the powerconditioning and thermal management module 1000 illustrated in FIGS.8-18, and described above, are equally applicable to the powerconditioning and thermal management module of FIG. 19A.

[0156] With continued reference to FIG. 19A, power conditioning andthermal management module 1000 may route the signals to and from device200 using any of the signal routing techniques described above. Powerand ground may be routed to and from electrical circuitry 112 and device200 using those same techniques, including the techniques illustrated inFIG. 6 and described above.

[0157] It should be noted that under those circumstances whereelectrical circuitry 112 of power conditioning element 1100 may besubjected to micro channel processing without damage, electricalcircuitry 112 may be fabricated before fabrication of the micro channelstructure. As such, the interface, power and ground vias may befabricated before or after the formation of the micro channel structure.The pads (if any) that connect to the vias may be fabricated after theother elements of power conditioning and thermal management module 1000.

[0158] In the embodiment of FIG. 19A, the power conditioning element andmicro channel structure of thermal management element 1200 arefabricated in one substrate. In still yet other embodiments, the entiremicro channel structure, or a portion of that structure, may befabricated on the backside of device 200. With reference to FIGS. 19Band 19C, micro channels 1220 of micro channel structure 1210 may befabricated entirely in device 200 (FIG. 19B) or partially in device 200and power conditioning element 1100 (FIG. 19C). The discussion abovewith respect to FIG. 19A is fully and equally applicable to powerconditioning and thermal management modules illustrated in FIGS. 19B and19C. For the sake of brevity, that discussion will not be repeated.

[0159] Another aspect of the present invention is the use of the moduleand/or elements described herein (for example, power conditioning module100, power conditioning and thermal management module 1000, thermalcapture and rejection module 1400, heat rejection element 1410 andthermal capture element 1420) as building blocks in designing a systemhaving local power conditioning functionality as well as heat capture,removal and/or rejection capabilities. For example, with reference toFIG. 20, in one embodiment, device 200 is disposed on printed circuitboard 400, and thermal capture element 1420 is disposed on device 200 tofacilitate capture of localized heat generated by device 200. The powerconditioning and thermal management module 1000 is disposed on thermalcapture element 1420. In this embodiment, it may be advantageous tolocate power conditioning element 1100 between thermal capture element1420 and thermal management element 1200 to enhance the capture of heatgenerated by power conditioning element 1100. Further, heat rejectionelement 1410 (for example, a heat sink having fins) may be disposed onthermal management element 1200 to permit enhanced rejection of the heatcaptured by thermal management element 1200 (generated primarily bypower conditioning element 1100) and thermal capture element 1420(generated primarily by device 200).

[0160] In the embodiment illustrated in FIG. 20, power conditioningelement 1100 is in close proximity to device 200. Power and groundconnections to and from power conditioning element 1100 may beaccomplished using a wire bond configuration described herein. (See, forexample, FIGS. 4 and 7).

[0161] With continued reference to FIG. 20, the pump (not shown) may bean electro-osmotic type pump(s) located in thermal management module1200 and/or thermal capture element 1420. Moreover, the pump need not belocated in thermal management module 1200 or thermal capture element1420 but rather may be a “stand alone” device. As suggested above, thepump may include a plurality of pumping mechanisms, including mechanismshaving configurations as described in the Kenny et al. Application.

[0162] Another example of using modules and/or elements as buildingblocks is illustrated in FIG. 21. With reference to FIG. 21, in thisembodiment, power conditioning and thermal management module 1000 isdisposed on device 200 and thermal capture element 1420 is disposed onpower conditioning element 1100 of power conditioning and thermalmanagement module 1000. Further, heat rejection element 1410 is disposedon thermal capture element 1420 to enhance the rejection of the heatcaptured by thermal management element 1200 (generated primarily bydevice 200) and thermal capture element 1420 (generated primarily bypower conditioning element 1100).

[0163] In addition, the power conditioning and thermal managementfunctions may be incorporated (in whole or in part) into other modulesor elements, or even the consuming device itself. In this regard, thesefunction(s) may be combined in consuming device to facilitate a morecompact and cost effective system. With reference to FIG. 22, in thisembodiment of the invention, power conditioning and thermal managementmodule 1000 is disposed in device 200 and thermal capture element 1420may be disposed on device 200 to enhance the rejection of the heatcaptured by thermal management element 1200 (generated by device 200 andpower conditioning element 1100). In addition, due to the closeproximity of thermal rejection element 1410 to device 200, thermalrejection element 1410 directly captures and rejects heat generated bydevice 200. However, under those circumstances where additional thermalcapture and rejection capacity provided by thermal rejection element1410 is not necessary, thermal rejection element 1410 may be omitted.

[0164] It should be noted that power conditioning and thermal managementmodule 1000 may be disposed on the back side of device 200 or powerconditioning element 1100 and/or thermal management element 1200 may bedisposed on the both the front and back sides of device 200. Moreover,power conditioning element 1100 may be disposed on the front side ofdevice 200 and thermal management element 1200 may be disposed on thebackside.

[0165] With reference to FIG. 23, in another embodiment of theinvention, system 2000 includes power conditioning module 100 that isdisposed in device 200 and thermal capture and rejection module 1400 maybe disposed on device 200 to provide thermal management of device 200and power conditioning element 1100. As with the embodiment illustratedin FIG. 22, power conditioning module 100 of FIG. 23 may be disposed onthe back side of device 200 or on the front side of device 200.Moreover, power conditioning module 100 may be disposed on the both thefront and back sides of device 200.

[0166] It should be noted that in all of the embodiments illustrated inFIGS. 20-23, the elements and modules, as well as the consuming devicethat includes the power conditioning and/or thermal managementfunctions/elements, may include the features, attributes, alternativesand advantages of the corresponding elements and modules illustrated inFIGS. 2-19, and described above. For the sake of brevity, thosefeatures, attributes, and advantages will not be restated here.

[0167] In addition, under those circumstances where thermal capture andrejection capacity provided by thermal rejection element 1410 is notnecessary, thermal rejection element 1410 may be omitted altogether.

[0168] Another aspect of the present invention is a system including aplurality of consuming devices, each having a power conditioning andthermal management module that receives power from a primary powersupply and a working fluid from a fluidic pumping mechanism. Withreference to FIG. 24, in this embodiment, primary power sup ply 3100provides initial power conditioning of an external power source (notshown). The output of primary power supply 3100 is provided to each ofthe power conditioning elements 1100 a-c of power conditioning andthermal management module 1000 a-c, respectively. The power conditioningelements 1100 a-c provide localized power conditioning for the consumingdevice 200 a-c, respectively. The power conditioning elements 1100 a-cmay be any one of the embodiments described above and illustrated inFIGS. 8-19.

[0169] The primary power supply 3100 provides the initially conditionedpower to each power conditioning elements 1100 a-c by way of power bus3110. The power bus 3110 may be routed in parallel to each of powerconditioning elements 1200 a-c.

[0170] The primary power supply 3100 may include discrete components,similar to that illustrated in FIG. 1, or may be a power conditioningmodule 1100, similar to that described above with respect to FIG. 2.Moreover, primary power supply 3100 may also include additional powersupply circuitry positioned more locally to the devices 200 a-c. Theadditional power supply circuitry may provide additional initialconditioning of the power before being supplied to power conditioningelements 1100 a-c.

[0171] With continued reference to FIG. 24, fluidic pumping mechanism3200 provides a working fluid to each of the thermal management elements1100 a-c of power conditioning and thermal management module 1000 a-c,respectively. The thermal management elements 110 a-c captures andremoves heat generated by devices 200 a-c and/or power conditioningelements 110 a-c. The thermal management elements 1100 a-c may be anyone of the embodiments described above and illustrated in FIGS. 8-19.Moreover, system 3000 of FIG. 24 may also include local heat rejectionelements (not shown) that are disposed on or near devices 200 a-c.System 3000 may also, or alternatively include a global heat rejectionelement (not shown) that rejects heat for one or more of the thermalmanagement elements 1100 a-c. The heat rejection element(s) may includethe features of the heat rejection element and thermal rejection moduleas illustrated in FIGS. 2-19 and described above.

[0172] The fluidic pump mechanism exchanges the working fluid with eachthermal management element 1200 a-c by way of fluid bus 3210. That is,pumping mechanism 3200 provides cool fluid to each thermal managementelement 1200 a-c using fluid bus 3210; and fluid bus 3210 provides apath for the heated fluid from thermal management element 1200 a-c tofluidic pump mechanism 3200. The fluid bus 3210 may be routed inparallel or series to each of thermal management elements 1200 a-c.

[0173] It should be noted that system 3000 of FIG. 24 may be implementedusing power conditioning module 100 illustrated in FIGS. 2-7, anddescribed above. Under this circumstance, the thermal managementoperations or functions may be performed in any manner, including thosedescribed above and illustrated in FIGS. 2-7, 20 and 21. Thus, dependingon the type of thermal management technique employed, a fluidic pumpmechanism 3200 and fluid bus 3210 may be unnecessary.

[0174] Various embodiments of the present invention have been describedherein. It is understood, however, that changes, modifications andpermutations can be made without departing from the true scope andspirit of the present invention as defined by the following claims,which are to be interpreted in view of the foregoing. For example, otherpermutations of the module(s) and element(s) combinations are possibleto provide a system having a power conditioning feature and a thermalmanagement feature. In this regard, other combinations of the modulesand elements in a building block approach, as illustrated in FIGS.20-23, are suitable and are contemplated, and, as such, fall within thescope of the present invention.

[0175] In addition, the power conditioning and thermal managementfeatures may be combined in other modules, elements, or devices of thesystem, including the consuming device as illustrated in FIGS. 22 and23, and described above. Incorporating features in this manner isclearly contemplated, and, thus falls within the scope of the presentinvention. Moreover, many different types of arrangement, layouts,configurations, designs, and techniques of micro heat exchangers, microchannels, sensors, and pump mechanisms are described and illustrated inthe Kenny et al. Application, which are all hereby incorporated byreference. Indeed, the Kenny et al. Application is incorporated byreference herein in total.

1-69. (Canceled)
 70. A thermal management module configureable to be coupled to an integrated circuit device, the thermal management module comprising: a. a substrate having at least a portion of a microchannel therein and configured to permit flow of a liquid therethrough, wherein the liquid provides thermal capture of heat generated by the integrated circuit device; and b. a first plurality of interface vias within the substrate for providing electrical connection with the integrated circuit device.
 71. The thermal management module according to claim 70 further comprising a power conditioning module for conditioning power applied to the integrated circuit device, wherein the power conditioning module includes a second plurality of interface vias within the substrate and configured to be in electrical communication with the first plurality of interface vias.
 72. The thermal management module according to claim 71 wherein the power conditioning module further comprising a circuit for conditioning the power applied to the integrated circuit device, wherein the circuit includes at least one voltage regulator and at least one capacitor configured within the substrate.
 73. The thermal management module according to claim 72 wherein the substrate further comprises a semiconductor substrate.
 74. The thermal management module according to claim 73 wherein the substrate further comprises a first interface and a second interface, wherein the first interface and the second interface are positioned in a predetermined configuration with one another.
 75. The thermal management module according to claim 74 further comprising a first set of pads configured on the first interface, wherein at least one pad in the first set is coupled to a corresponding one of the plurality of interface vias.
 76. The thermal management module according to claim 75 further comprising a second set of pads configured on the second interface, wherein at least one pad in the second set is coupled to a corresponding one of the plurality of interface vias.
 77. The thermal management module according to claim 76 further comprising a. at least one power pad configured on an appropriate second interface; and b. at least one power via for providing electrical connection between the appropriate interface and the at least one voltage regulator and capacitor, wherein the power via is coupled to the at least one power pad.
 78. The thermal management module according to claim 77 further comprising a power conduit for providing electrical connection between the at least one power via and the at least one voltage regulator and capacitor, the power conduit configured in the substrate and coupled to the at least one power via.
 79. The thermal management module according to claim 71 further comprising at least one output power conduit for providing conditioned power to the integrated circuit device, the output power conduit configured in an appropriate interface of the substrate.
 80. The thermal management module according to claim 79 wherein the at least one output power conduit is coupled to an input power pad, wherein the input power pad corresponds to an input of the integrated circuit device.
 81. The thermal management module according to claim 70 further including a sensor for providing information representative of operating conditions in the integrated circuit device.
 82. The thermal management module according to claim 81 wherein the sensor provides temperature information in a predetermined temperature region.
 83. The thermal management module according to claim 81 further comprising a controller for controlling an operating level of the thermal management module in response to the information received from the sensor, wherein the controller is coupled to the thermal management module and the sensor. 84-94. (Canceled)
 95. An apparatus configureable to be coupled to an integrated circuit device comprising: a. means for conditioning power applied to the integrated circuit device, the means for conditioning configured to provide electrical connection between the integrated circuit device and a circuit board; and b. means for cooling the interface circuit device, the means for cooling coupled to the means for conditioning and configured to provide electrical connection between the integrated circuit device and the circuit board.
 96. A thermal management system comprising: a. at least one thermal management element coupled to one or more integrated circuit devices for capturing thermal energy generated by the one or more integrated circuit devices using a fluid channeled therethrough; and b. at least one pump coupled to the at least one thermal management elements for circulating the fluid thereto; c. at least one heat rejection element coupled to the at least one pump, wherein the at least one heat rejection element cools fluid heated by the at least one thermal management module; and d. a device coupled to the at least one thermal management element, wherein the device is one of a group consisting of an additional thermal management element, an additional pump and an additional heat rejection element.
 97. The thermal management system according to claim 96 wherein the thermal management element further comprises a substrate configured to permit flow therethrough and having a plurality of fluidic paths for channeling fluid.
 98. The thermal management system according to claim 96 wherein the thermal management element further comprises at least one control module having: a. a substrate; b. a plurality of interface vias to provide electrical connection through the substrate; and c. electrical circuitry disposed in the substrate and configured to condition power applied to the integrated circuit device.
 99. The thermal management system according to claim 96 wherein two pumps provide fluid to the at least one thermal management element.
 100. The thermal management system according to claim 96 further comprising at least one sensor coupled thereto, the at least one sensor for providing information representative of one or more operating conditions in the integrated circuit device.
 101. The thermal management system according to claim 101 wherein the sensor provides temperature information regarding a predetermined temperature region. 